Title:
BURIED FRAME IN UNDERGROUND
Document Type and Number:
Japanese Patent JP3490602
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To produce no waste even if a frame is buried under the ground while supporting a buried pipe.
SOLUTION: A temporary frame 10, which is installed to keep the position of a PC cable 1 laid in a predetermined position in an excavated space 6 to be backfilled with backfilling earth, is constructed of assembling material comprising biodegradable resin molded members, the temporary frame 10 being left behind in the ground along with the PC cable 1 by the backfilling of the excavated space 6. The temporary frame 10 biodegrades and dissipates when left behind under the ground.
Inventors:
Eiji Hayashi
Shinichiro Mori
Shigeru Toyama
Shinichiro Mori
Shigeru Toyama
Application Number:
JP36639097A
Publication Date:
January 26, 2004
Filing Date:
December 24, 1997
Export Citation:
Assignee:
Tobishima Construction Co., Ltd.
RIKEN TECHNOS CO., LTD.
RIKEN TECHNOS CO., LTD.
International Classes:
E02D27/46; C08L101/16; (IPC1-7): E02D27/46
Domestic Patent References:
| JP496607U | ||||
| JP591295U |
Attorney, Agent or Firm:
Tetsuro Sunaba
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