PURPOSE: To enable the same burn-in boards to be applied to various kinds of ICs by using them in common, where the burn-in boards used in an IC manufacturing process are required to be separately formed when wirings are slightly different from each other even if the same IC socket and the mounting components are used.

CONSTITUTION: A burn-in board is composed of a component board 1 mounted with an IC socket 3, mounted components 4, and a power supply GND terminal 5, and a wiring board 2 provided with a mounted component terminal receiving socket 6 and a wiring pattern 7, and the same component board 1 is combined with various kinds of the wiring board 2 of different wiring pattern to replace the other combined board used for a burn-in board, whereby the combined boards can be applied to various kinds of burn-in boards. By this setup, the same burn-in board can be used in common, which is conducive to the reduction of it in manufacturing cost, storage floor area, and manufacturing term.