Title:
CMP研磨液、基板の研磨方法及び電子部品
Document Type and Number:
Japanese Patent JP5088452
Kind Code:
B2
Inventors:
Takashi Shinoda
Kazuhiro Enomoto
Toshiaki Akutsu
Kazuhiro Enomoto
Toshiaki Akutsu
Application Number:
JP2012130748A
Publication Date:
December 05, 2012
Filing Date:
June 08, 2012
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| JP2005158867A | ||||
| JP2008294398A | ||||
| JP2008277735A | ||||
| JP2006229215A | ||||
| JP2007535118A | ||||
| JP2005518090A | ||||
| JP2009212378A | ||||
| JP20017060A | ||||
| JP2009212473A | ||||
| JP200994430A | ||||
| JP2009504551A | ||||
| JP200466027A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Tomoya Furoshita
Yoshinori Shimizu
Tomoya Furoshita