Title:
結束バンド用切断装置
Document Type and Number:
Japanese Patent JP7220408
Kind Code:
B2
Abstract:
To provide a binding band cutting device which facilitates alignment of a band part of a binding band.SOLUTION: A binding band cutting device 1 cuts a band part T1 of a binding band T. The binding band cutting device 1 includes: a first blade part 2 and a second blade part 3 which can relatively move between a separation position in which they separate from each other and an adjacent position in which they are adjacent to each other, and cut the band part T1 by moving to the adjacent position and pinching it between them; and a guide part 4 which guides the band part T1 between the first blade part 2 and the second blade part 3. The guide part 4 guides the band part T1 in a state that the band part T1 can rotate around an axis along a length direction X of the band part T1.SELECTED DRAWING: Figure 1
Inventors:
Shingo Yoshitomi
Minoru Sachiji
Minoru Sachiji
Application Number:
JP2019139201A
Publication Date:
February 10, 2023
Filing Date:
July 29, 2019
Export Citation:
Assignee:
Alam Co., Ltd.
Toa Intersystem Co., Ltd.
Toa Intersystem Co., Ltd.
International Classes:
B26B17/00
Domestic Patent References:
| JP2018030638A | ||||
| JP7241781A | ||||
| JP5305916A | ||||
| JP11180408A | ||||
| JP7069318A | ||||
| JP2010000322A |
Attorney, Agent or Firm:
Patent Attorney Corporation Asahina Patent Office