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Title:
CARD WITH NON-CONTACT MEMORY MEDIUM AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH09109577
Kind Code:
A
Abstract:

To eliminate the damage of a card base material even if an external force is applied to a card by providing one or more holes at a core in the card having a memory medium held in a non-contact state by sealing the core covering the entire memory medium connected with a coil with resin in the base material.

The entire memory medium connected with a coil 4 to an IC 3 is covered with rain, sealed and a core 1 is molded. Then, at least one or more holes 2 are opened at the core 1. The holes 2 are so provided as to be uniformly dispersed on the surface of the core 1 at about 1/2 or more of the area of the core 1. Then, the core 1 is installed in a mold, and thermoplastic resin is cast to form a card. Films made of the thermoplastic resin are laminated to both sides of the core 1 to complete a predetermined card. Thus, according to that the two or more holes 2 are provided at the core 1, even if the card is unnaturally bent, the force is dispersed by the holes 2 to make it possible to prevent the damage of the card.


Inventors:
WAKANA MASAHIKO
Application Number:
JP26513695A
Publication Date:
April 28, 1997
Filing Date:
October 13, 1995
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B42D15/10; B29C41/10; G06K19/07; G06K19/077; H01L21/56; (IPC1-7): B42D15/10; B29C41/10; G06K19/07; G06K19/077; H01L21/56



 
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