PURPOSE: To provide a carrier for a double polishing device which can reliably remain on the lower platen side by a method wherein the upper and lower surfaces of the carrier are formed so that adhesion to polishing cloth of an upper platen is differed from that to polishing cloth of the lower platen.

CONSTITUTION: A recessed part 13 is formed in the central part of the upper surface of a carrier 11 with a distance between holes 12 and the recessed part, and a small through-hole 14 is formed in the center of the recessed part. Rectangular recessed parts 15 are formed closer to the upper surface and between the adjoining holes 12, and a small through-hole 16 is formed in the rectangular recessed part. The thickness of the carrier 11 is set to a value slightly lower than that of a work 7 but since polishing cloth 3 and 4 have slight elasticity, thin abrasive material layers are formed between the polishing cloth 3 and 4 and the upper and lower surfaces of the carrier 11. When, during completion of polishing, an upper platen 2 is raised, and a force by which the carrier 11 is lifted up is exerted by means of surface tension of an abrasive material. A difference is produced between the areas of the upper and the lower surfaces, adhered to the polishing cloth 3 and 4, respectively, of the carrier 11, and since the surface area of the upper surface is decreased to a value lower than that of the under surface, the carrier 11 is caused to remain on the lower platen 1 side.