CARRIER MATERIAL FOR CHIP ELECTRONIC PART AND ITS MANUFACTURE

Title:

CARRIER MATERIAL FOR CHIP ELECTRONIC PART AND ITS MANUFACTURE

Document Type and Number:

Japanese Patent JP2000007020

Kind Code:

A

Abstract:

To provide a carrier material for chip electronic parts which is capable of preventing adherence or fusion of the chip electronic parts when the chip electronic parts are stored and carried.

A carrier 1 for a tape-like chip electronic parts comprises a base material layer 2 in which storage holes 4 to store the chip electronic parts 7 are formed in the longitudinal direction with specified intervals, and a thermoplastic resin layer 3 having no support base material provided on one surface of the base material layer 2. The thickness of the thermoplastic resin layer 3 is about 5-150 μm, and the softening point of the thermoplastic resin layer 3 is about 60-290°C, and the total light transmittance is not less than about 70%. The surface resistance of the thermoplastic resin layer 3 side is about 102-1013 Ω.

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Inventors:

NAKANO ICHIRO
NAGASAKI KUNIO
ICHIKAWA HIROKI

Application Number:

JP18812898A

Publication Date:

January 11, 2000

Filing Date:

June 17, 1998

Export Citation:

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Assignee:

NITTO DENKO CORP

International Classes:

B65D73/02; B65B15/04; B65D85/86; (IPC1-7): B65D73/02; B65B15/04; B65D85/86

Attorney, Agent or Firm:

Yukihisa Goto

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