Title:
CARRIER FOR SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP3263856
Kind Code:
B2
Abstract:
PURPOSE: To surely and easily perform the insertion operation of semiconductor wafer into a carrier for semiconductor wafer use.
CONSTITUTION: A carrier is featured in the following manner: a plurality of grooves 4 for semiconductor water insertion use are formed, so as to be faced with each other, in individual inner faces of sidewalls 2, 3 which are faced with each other; the grooves 4 on both inner faces are divided into a plurality of regions; and groove discrimination marks 11 whose shape, size and/or color are different form those of adjacent regions are put on individual guards 7, 8 near groove numbers 9 at the individual grooves 4 in the individual regions. Thereby, it is possible to prevent the erroneous insertion operation of a semiconductor wafer 5 into the carrier 1, the efficiency of the insertion operation of the semiconductor wafer 5 is enhanced, and the fatigue of an operator can be reduced.
Inventors:
Shinobu Hidaka
Application Number:
JP9614992A
Publication Date:
March 11, 2002
Filing Date:
April 16, 1992
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B65D85/57; B65D85/86; B65G49/07; H01L21/673; H01L21/68; (IPC1-7): H01L21/68; B65D85/86
Domestic Patent References:
| JP1152641A | ||||
| JP4242578A | ||||
| JP1152640A | ||||
| JP61191332U | ||||
| JP6289143U | ||||
| JP6157524U |
Attorney, Agent or Firm:
Kuninori Funabashi
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