CASTING EPOXY RESIN COMPOSITION AND ELECTRIC APPLIANCE USING THE SAME

Japanese Patent JP2013035899

A

To provide a casting epoxy resin composition superior in flowability as well as in thermal conductivity.

The casting epoxy resin composition is characterized by containing: an epoxy resin showing a liquid state at room temperature and having two or more epoxy groups per molecule; an epoxy resin curing agent showing a liquid state at room temperature; a plate-like inorganic filler; and a spherical alumina filler. The plate-like inorganic filler and spherical inorganic filler have two or more maximal points in a particle distribution as a whole, and the mass ratio of the plate-like inorganic filler is 5-20 mass% of the total mass of the inorganic filler, the total mass being obtained by totalizing the masses of the plate-like inorganic filler and spherical inorganic filler combined together.

JP5740303

Method for manufacturing curable composition, pre-cured sheet, dicing-die bonding tape, connection structure and semiconductor chip with adhesive layer

MOGI AKIRA
KAGAWA HIROYUKI
KOBAYASHI MASAHITO

JP2011171051A

February 21, 2013

August 04, 2011

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HITACHI LTD

C08L63/00; C08K7/00; C08K7/18; H01L23/29; H01L23/31

JP2005232313A

2005-09-02

Polaire Patent Business Corporation

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