Title:
CERAMIC ELECTRONIC COMPONENT,ITS MANUFACTURING METHOD, AND INJECTING DEVICE
Document Type and Number:
Japanese Patent JP3921171
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a ceramic electronic component which suppresses damage of an interface between an insulating layer and a conductor laminated therewith, a method for manufacturing the electronic component, and an injecting device.
SOLUTION: The ceramic electronic component is provided with a plurality of laminated piezoelectric materials 1, internal electrodes 2 provided to partial regions between the piezoelectric materials 1, and an electronic component main body 1a. The piezoelectric materials 1 and the internal electrodes 2 are simultaneously baked. The density of a conductor nonformation region Y of the piezoelectric materials 1 between an end of an internal electrode 2 and a side surface of the main body 1a buried between the piezoelectric materials 1 is substantially the same as the density of the other piezoelectric materials 1.
Inventors:
Shigenobu Nakamura
Application Number:
JP2002377489A
Publication Date:
May 30, 2007
Filing Date:
December 26, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
F02M51/00; H01L41/083; F02M51/06; H01L41/187; H01L41/22; H01L41/273; H01L41/297; H01L41/337; (IPC1-7): H01L41/083; F02M51/00; F02M51/06; H01L41/187; H01L41/22
Domestic Patent References:
| JP8242023A | ||||
| JP3730893B2 | ||||
| JP5003349A | ||||
| JP2001156348A | ||||
| JP2002162518A | ||||
| JP2002009359A | ||||
| JP10173248A |