Title:
セラミック電子部品及びその製造方法
Document Type and Number:
Japanese Patent JP5176775
Kind Code:
B2
Abstract:
This invention provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same. A ceramic electronic component 1 has a ceramic element assembly 10, external electrodes 14 and 15, and metal terminals 16 and 17. The external electrodes 14 and 15 are formed on the surface of the ceramic element assembly 10. The external electrodes 14 and 15 contain a sintered metal. The metal terminals 16 and 17 are electrically connected to the external electrodes 14 and 15, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals 16 and 17 into the external electrodes 14 and 15.
Inventors:
Hideki Otsuka
Kazuhiro Yoshida
Jun Sonoyama
Itagaki Kaiji
Akihiko Nakata
Kazuhiro Yoshida
Jun Sonoyama
Itagaki Kaiji
Akihiko Nakata
Application Number:
JP2008211975A
Publication Date:
April 03, 2013
Filing Date:
August 20, 2008
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/228; H01G2/06; H01G4/232; H01G4/30
Domestic Patent References:
| JP2000306764A | ||||
| JP6204096A | ||||
| JP2001044069A | ||||
| JP2007109883A | ||||
| JP62040818U | ||||
| JP8288173A | ||||
| JP2005262244A | ||||
| JP5217457A | ||||
| JP2004039270A |
Foreign References:
| WO2006126352A1 |
Attorney, Agent or Firm:
宮▲崎▼ 主税