To provide a ceramic package for storing an electronic component in which the package can be lightened and miniaturized, and a flattened surface in the widthwise direction of a conductor metal film on the top face of a frame body can be enlarged to enhance hermetic reliability, and to provide a manufacturing method therefor.

The ceramic package 10 for storing an electronic component comprises a burned body into which one or a plurality of base plates body 11, and one or plurality of window-shaped platy frame body 12 plates are integrated, and has a conductor metal film 20 for directly bonding a metal lid body 19 on the top face of the frame body 12 via a bonding material after an electronic component is mounted in a cavity 13 which is formed by the top face of the base plate body 11 and the inner wall surface of the frame body 12. At least a cavity 13 side end of the frame width of the conductor metal film 20 extends up to the side edge 21 of the frame body 12, and the top face of the cavity 13 side end of the frame width of the conductor metal film 20 has a flattened surface having substantially the same thickness as that of the center part of the frame width of the conductor metal film 20.