To provide a charge trap non-volatile memory which can simplify the fabrication process.
There is disclosed a non-volatile memory cell structure utilizing a charge trapping high-k dielectric (22) in the place of a triple film stack. The charge trapping characteristic of the high-k dielectric can be further improved by exposing the high-k dielectric layer (22) to a treatment process such as plasma exposure using excited state oxygen (e.g. oxygen plasma) atmosphere. By using a single layer (22) as the charge trapping gate dielectric, a simple and inexpensive solution is presented that permits device scaling to very small dimensions, together with the ease of device fabrication processes. The fabrication process for the charge trapping high-k gate dielectric of the present invention is also applicable to a bulk device, a TFT device or an SOI device.
CONLEY JOHN F JR
JOSHI POORAN CHANDRA
Takaaki Yasumura
Takeshi Oshio
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