Title:
CHEMICAL MECHANICAL POLISHING EQUIPMENT
Document Type and Number:
Japanese Patent JP2002246346
Kind Code:
A
Abstract:
To uniformly polish the inside of a surface of a wafer 16, by applying pressure to a polishing pad partially considering the condition of the surface of the wafer 16, while the initial warpage and deformation of the wafer 16 are kept, in chemical mechanical polishing equipment for polishing the wafer 16.
The wafer 16 is held by a wafer holder 1, while the initial deformation and amount of warpage are kept constant. Tubes 4 which press partially the polishing pad 3 considering the condition of the surface, such as unevenness of the surface of the wafer are installed. The inside of the surface of the wafer is polished uniformly by controlling pressure loading of the tubes 4.
Inventors:
TANAKA YOSHIKAZU
Application Number:
JP2001037610A
Publication Date:
August 30, 2002
Filing Date:
February 14, 2001
Export Citation:
Assignee:
HIROSHIMA NIPPON DENKI KK
International Classes:
B24B37/005; H01L21/304; (IPC1-7): H01L21/304; B24B37/00
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)