Title:
CHEMICAL MECHANICAL POLISHING METHOD FOR DIAMOND THIN FILM
Document Type and Number:
Japanese Patent JP3734722
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To modify a diamond thin film on a smooth surface without defectives in nanometer order by polishing the diamond thin film by chemical mechanical polishing combined with a chemical reaction and a mechanical action by abrasive grain.
SOLUTION: The diamond thin film is impregnated into oxidizing polishing liquid dispersed with abrasive grain having an oxidation catalyst action and the diamond thin film is polished, grazing the surface of the thin film by abrasive grain. As abrasive grain, chromium oxide and iron oxide, etc., having oxidation catalyst actions, for instance, are used. It is desirable that polishing liquid dispersed with abrasive grain in hydrogen peroxide water, nitrate water solution or the mixed liquid is prepared.
Inventors:
Yutaka Takahashi
Application Number:
JP2001153758A
Publication Date:
January 11, 2006
Filing Date:
May 23, 2001
Export Citation:
Assignee:
Japan Science and Technology Agency
International Classes:
B24B37/00; (IPC1-7): B24B37/00
Domestic Patent References:
| JP2001205555A | ||||
| JP11207603A | ||||
| JP2000049124A | ||||
| JP2000204353A |
Attorney, Agent or Firm:
Wataru Ogura