Title:
CHIP FOR COATING UTENSIL AND PRODUCTION OF CHIP
Document Type and Number:
Japanese Patent JP3677337
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the firmness of attachment when a specular part having complete roundness is brought into contact with a ball, to enhance airtightness and to suppress the leakage of ink when the chip to be used in a coating utensil such as a retouching pen is not used.
SOLUTION: A ball 3 in the ball holding part 2a of a socket 2 is pushed and brought into contact with the inner periphery 2c of a tip 2b to keep airtightness in the chip 1 of a coating utensil, and a specular part 2d is formed along the inner periphery of the tip in the shape of a strip from a tip. The tip of the ball holding part is calked so that the inner diameter of the tip is slightly smaller than the diameter of the ball, and then the ball is forced under pressure into the ball holding part from the tip and engaged to produce the chip. Further, the tip is recalked after the ball is engaged to produce the chip.
Inventors:
Kenichi Kasukawa
Kimihito Suzuki
Makoto Hayashi
Kimihito Suzuki
Makoto Hayashi
Application Number:
JP34297195A
Publication Date:
July 27, 2005
Filing Date:
December 28, 1995
Export Citation:
Assignee:
Teibow Co., Ltd.
International Classes:
B43K1/08; B05C17/00; B21D39/00; (IPC1-7): B05C17/00; B21D39/00; B43K1/08
Domestic Patent References:
| JP5058089A | ||||
| JP7040180U | ||||
| JP8067091A |
Attorney, Agent or Firm:
Sadayuki Hosoi
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