To unify different coordinates imparted to each chip in a wafer, on which arrays of the chips are identical by a method, wherein the new coordinates, which are obtained by converting coordinates of each chip in order one by one in a coordinate system conversion part, a rotation conversion part and a shift conversion part, of each chip are outputted.

A coordinate conversion device 1 is constituted of an input part 11, a storage part 12 connected with this input part 11, an arithmetic processing part 13 connected with this storage part 12 and an output part 14 connected with this arithmetic processing part 13. Moreover, the part 13 is constituted of a coordinate system conversion part 13a, a rotation conversion part 13b and a shift conversion part 13c. The part 12 is connected with measuring equipments 2a and 2b and the part 14 is connected with a data analyzing system 3. According to this device 1, since the coordinates of each chip are converted into the coordinates in the case where a wafer is arranged in and at a reference layout state and a reference layout position in a reference coordinates, different coordinates imparted to each chip can be unified in a batch.