Title:
CHIP SPAWN WEDGING MACHINE
Document Type and Number:
Japanese Patent JP3854971
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a compact and inexpensive chip spawn wedging machine preventing destroy of chip spawn and automating planting while preventing chip spawn from dropping off.
SOLUTION: This chip spawn wedging machine 1 has a support body attached with a punching means 2 punching holes on a raw wood, a chip spawn guide mechanism 3 of receiving, at a predetermined receiving place, one chip which is sent out in a posture with a small diameter part previously turned downward and moving the chip spawn to a predetermined wedging place so as to prepare for wedging to the raw wood, and a hammer driving mechanism 4 for wedging the chip spawn prepared for wedging with a hammer 16 to the raw wood by using the chip spawn guide mechanism 3. The chip spawn guide mechanism 3 is such a mechanism that a chip spawn guide piece 21 holding the chip spawn is installed in an interval from the receiving place to the wedging place, and the chip spawn guide piece 21 is axially supported on the support body in a freely rotatable manner in the horizontal direction and set in a freely sliding manner in the vertical direction in the wedging place.
Inventors:
Yutaka Murata
Application Number:
JP2004035552A
Publication Date:
December 06, 2006
Filing Date:
February 12, 2004
Export Citation:
Assignee:
Murata Seiko Co., Ltd.
International Classes:
A01G1/04; (IPC1-7): A01G1/04
Domestic Patent References:
| JP2119722A | ||||
| JP11103669A | ||||
| JP2003169539A |
Attorney, Agent or Firm:
Masaru Ishihara
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