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Patent Searching and Data


Title:
CHIP TYPE SOLID ELECTROLYTIC CAPACITOR
Document Type and Number:
Japanese Patent JPS641223
Kind Code:
A
Abstract:

PURPOSE: To eliminate an improper disconnection of wirings and improper contact of loss angle even at the time of mounting a solid electrolyte capacitor element of a cathode side outer terminal by soldering by eliminating the presence of a solder plating at the bonded section of the terminal to the element.

CONSTITUTION: An oxide film 21, a semiconductor layer 22 and a cathode layer 23 are sequentially formed on an anode 2 to form a solid electrolytic capacitor element 4. On the other hand, a cathode side outer terminal 6 and an anode side outer terminal 7 plated in advance with solders 61, 71 are prepared. In this case, the solder plating is not conducted at the bonded section 62 of the terminal 6 to the element 4. The section 62 is formed by a method for not forming the solder plating with a mask formed in advance, or a method for removing solder plating by mechanical working such as luting or optical working such as laser working. Then, the section 62 of the terminal 6 to the element 4 is secured with a conductive adhesive 5, an anode lead 3 and the anode side outer terminal 7 are welded, and a resin sheath 8 is formed.


Inventors:
KURIHARA KANAME
SUZUKI NORIAKI
Application Number:
JP15611287A
Publication Date:
January 05, 1989
Filing Date:
June 23, 1987
Export Citation:
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Assignee:
ELNA CO LTD
International Classes:
H01G9/012; (IPC1-7): H01G9/05
Domestic Patent References:
JPS6011441B21985-03-26