Title:
回路基板及びこれを用いた回路モジュール
Document Type and Number:
Japanese Patent JP7384121
Kind Code:
B2
Abstract:
[Problem] To provide a circuit board in which an electronic component that is the heat radiation target and the heat radiation path on a motherboard are electrically insulated, and which achieves high heat radiation efficiency. [Solution] A circuit board 1 comprising: a substrate 10 obtained by alternately laminating wiring layers L1-L4 and insulation layers 11-13; a heat transfer block 40 constituted by an insulating ceramic material embedded in the insulation layer 12; a wiring pattern P21 in contact with a surface 41 of the heat transfer block 40; and a wiring pattern P41 in contact with a surface 42 of the heat transfer block 40. The surface 41 of the heat transfer block 40 has a recess 41b. Part of the wiring pattern P21 is embedded in the recess 41b. Thus, it is possible to ensure insulation of the wiring patterns P21, P41 while radiating heat via the heat transfer block 40. Furthermore, because the wiring pattern P21 is embedded in a recess in the heat transfer block 40, separation due to a difference in the thermal expansion coefficients thereof is unlikely to occur.
Inventors:
Kazutoshi Tsuyuya
Ken Yokoyama
Toshiyuki Abe
Michitaka Okazaki
Ken Yokoyama
Toshiyuki Abe
Michitaka Okazaki
Application Number:
JP2020118352A
Publication Date:
November 21, 2023
Filing Date:
July 09, 2020
Export Citation:
Assignee:
SAE Magnetics(H.K.)Ltd.
International Classes:
H05K3/46; H01L23/12; H01L23/36; H05K1/02
Domestic Patent References:
| JP2014168053A | ||||
| JP2018207081A | ||||
| JP2015103809A |
Foreign References:
| US20070284711 | ||||
| US20140268572 |
Attorney, Agent or Firm:
Mitsuhiro Washito
Ogata Japanese
Ogata Japanese