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Patent Searching and Data


Title:
CIRCUIT BOARD FOR HYBRID FUNCTION CIRCUIT
Document Type and Number:
Japanese Patent JPH03242946
Kind Code:
A
Abstract:

PURPOSE: To prevent the oversight as to whether or not connection is made normally and reliably by a method wherein a pad for circuit connection in a part which is hard to check and determined by electrical inspection of function is formed to be different in a shape from another pad for circuit connection on the occasion when a necessary hybrid function circuit device is constructed.

CONSTITUTION: In a group of pads 2 for circuit connection which are provided in arrays oppositely to each other on a face of a prescribed region of an insulative board 1, a pad 2a in a part which is selected and set beforehand and hard to check and determine by electrical inspection of function after wire bonding is made is made different in a shape or a size from another pad 2b. Accordingly, attention is paid to the difference in the shape of the pad for connection and execution of concentrated observation is enabled at the time of visual inspection, and a spot being hard to detect by the electrical inspection of function is indicated selectively beforehand in the visual inspection as to whether a large number of bonding wires 5 existing at small pitches form normal and reliable connections or not. Thereby an over-sight in the visual inspection can be avoided extensively.


Inventors:
SHINODA KATSUYOSHI
Application Number:
JP4042890A
Publication Date:
October 29, 1991
Filing Date:
February 21, 1990
Export Citation:
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Assignee:
TOSHIBA CORP
TOSHIBA SAAKITSUTO TECHNOL KK
International Classes:
H05K3/34; H01L21/60; H01L25/04; H01L25/18; H05K1/02; H05K1/11; (IPC1-7): H01L21/60; H01L25/04; H01L25/18; H05K3/34
Attorney, Agent or Firm:
Saichi Suyama