回路基板、イメージセンサーモジュール、レンズ駆動装置、およびこれを含むカメラモジュール

Japanese Patent JP7471341

B2

A circuit board (700) according to an embodiment includes an insulating portion (710); and a pattern portion (720) disposed on the insulating portion (710), wherein the insulating portion (710) includes: a first insulating region (711), and a second insulating region (712) disposed outside the first insulating region (711) and spaced apart from the first insulating region (711) with a separation region (713) therebetween; wherein the pattern portion (720) includes: a first pattern portion (721) for signal transmission; and a second pattern portion (722) including a dummy pattern separated from the first pattern portion, wherein the first pattern portion (721) includes: a first terminal portion (721-1) disposed on the first insulating region (711); a second terminal portion (721-2) disposed on the second insulating region (712); and a connection portion (721-3) disposed on the separation region (713) and connecting between the first terminal portion (721-1) and the second terminal portion (721-2), wherein the second pattern portion (722) includes: a second-first pattern portion (722-1) disposed on the first insulating region (711); and a second-second pattern portion (722-2) disposed on the second insulating region (712) and separated from the second-first pattern portion (722-1).

Kim Hae Sik
Choi So Hee
Pekchihum
kwon na kyung

JP2022070047A

April 19, 2024

April 21, 2022

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LG Innotek Company Limited

G03B17/02; G03B5/00; H04N23/68

WO2021071303A1
WO2020162688A1
US20200196447

Atsushi Aoki
Shinji Mihashi
Akira Kawai
Tomohiro Minamiyama
Minoru Takemoto

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