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Title:
CIRCUIT BOARD FOR MICROWAVE MODULE
Document Type and Number:
Japanese Patent JP2004281713
Kind Code:
A
Abstract:

To provide a circuit board for a microwave module which is provided with an insulation film that has an excellent dielectric characteristic corresponding to high-frequency communication and superior properties such as hygroscopicity resistance, mechanical property or heat resistance, etc. through stable and efficient formation by photo processing.

The circuit board for a microwave module is provided with an insulation film made of polyether-based resin with a repetitive unit expressed by a general formula (I). In the formula, A represents a bivalent alkylene group of carbon numbers 1-10, -SO2-, -SO-, -S-, -O-, or -CO-. a and b are independent integers of 0 to 4, m is an integer of 0 or 1, n is an integer of 1 t 3. R1 to R6 independently represent either of hydrogen atom, alkyl group of carbon numbers 1-8, and halogen atom, and at least one of R1 to R4 is a group other than hydrogen atom.


Inventors:
GOTO KENICHI
KAMATA JUN
TAMAI MASAJI
Application Number:
JP2003071102A
Publication Date:
October 07, 2004
Filing Date:
March 17, 2003
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08G65/40; H01L23/14; H05K1/03; (IPC1-7): H05K1/03; C08G65/40; H01L23/14