PURPOSE: To obtain a circuit board with inductance element suitable for constituting a high-frequency mounting circuit device, etc., by electrically connecting a conductor pattern film formed in a chip-shaped core with the conductor pattern film of a circuit board body.
CONSTITUTION: A circuit board body is constituted when a required circuit pattern 4a, a resistor and a plurality of streaks of conductor pattern films 5a forming a part of inductance coil are printed and baked on a principal plane. These conductor pattern films 5a are formed almost parallel to each other. On the other hand, a ceramic core chip 5b, in which a plurality of streaks of conductor pattern films 5c constituting a required inductance coil at the time of arrangement and connection with the conductor pattern films 5a are formed on the peripheral face, is provided on the region of the conductor pattern films 5a. Then, after this ceramic core chip 5b is arranged on the region forming the conductor pattern films 5a, the conductor pattern films 5c are electrically connected in the manner of corresponding to the conductor pattern films 5a so that a desired inductance coil is constituted.
| WO/1992/003834 | HIGH VOLTAGE ISOLATION TRANSFORMER |
| JPH09320855 | HIGH-FREQUENCY COIL |
| JP5513848 | Inductor |
YAMAKAWA MITSUAKI
SAKAMOTO KAZUNORI
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