Title:
回路基板、無線装置、及び回路基板の製造方法
Document Type and Number:
Japanese Patent JP6882951
Kind Code:
B2
Abstract:
To provide a circuit board of a small size capable of propagating a radio wave between a front surface and a back surface of the circuit board.A circuit board includes: a through hole that penetrates between a front surface and a back surface of the circuit board; and a waveguide formed in the through hole, the waveguide including a dielectric having a rectangular parallelepiped shape and a conductor covering surfaces other than a first surface and a second surface of the dielectric, the first surface being on a front surface side of the circuit board, the second surface being on a back surface side of the circuit board.
Inventors:
Koichiro Iwata
Application Number:
JP2017145052A
Publication Date:
June 02, 2021
Filing Date:
July 27, 2017
Export Citation:
Assignee:
Fujikura Ltd.
International Classes:
H01P3/12; H01L23/12; H01P1/04
Domestic Patent References:
| JP6268402A | ||||
| JP2010081486A |
Foreign References:
| WO2010125835A1 | ||||
| US20170048969 |
Attorney, Agent or Firm:
Isshiki International Patent Service Corporation