Title:
CIRCUIT COMPONENT AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3928243
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the generation of abrasion powder in a sliding section on a substrate and thereby avoid a defective conduction, by forming a conductive section and an insulating section of the substrate by injection molding of resin, and forming a carbon-contained conductive layer on the sliding section on the substrate.
SOLUTION: In a substrate 1 which will be a circuit component, a conductive section 3 connected to connectors 4 and an insulating section 6 are formed by injection molding of resin. In a sliding section 5 of the substrate 1, one terminal 2b of a brush 2 which is a contact member is slide along a conductive section 3b and the other terminal 2a is in contact with a conductor 3a or the insulating section 6 and has a switching function. The conductive section 3 has a layered structure wherein conductive resin is deposited on an insulating layer and a carbon-contained conductive layer is formed on the conductive resin to protect the sliding section 5. By this method, a good slidability can be obtained and a defective conduction can be prevented.
Inventors:
Akikazu Matsumoto
Application Number:
JP4782098A
Publication Date:
June 13, 2007
Filing Date:
February 27, 1998
Export Citation:
Assignee:
Aisin Seiki Co., Ltd.
International Classes:
H05K1/09; H05K1/16; B29C45/14; B29C45/16; H05K3/00; (IPC1-7): H05K1/16; B29C45/14; B29C45/16; H05K1/09; H05K3/00
Domestic Patent References:
| JP4329226A | ||||
| JP6212429A |