Title:
CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER
Document Type and Number:
Japanese Patent JP2011032479
Kind Code:
A
Abstract:
To provide a circuit connecting material with which sufficient adhesive strength can be obtained, when connecting a circuit member having a substrate made of polyester terephthalate, polyimide resin, polyethersulfone, acrylic resin or glass, or a circuit member, wherein a layer made of silicone resin, polyimide resin, acrylic resin, etc., is formed on its surface.
The circuit connecting material 1 contains an adhesive composition which is cured by light or heat, and an organic compound having an urethane group and an ester group, the organic compound having an aromatic group and an alicyclic group, and is used to connect circuit members provided with a substrate and a circuit electrode formed on its main surface.
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Inventors:
ARIFUKU MASAHIRO
MOCHIZUKI AKIOMI
NAKAZAWA TAKASHI
KOBAYASHI KOJI
FUJINAWA MITSUGI
TATEZAWA TAKASHI
MOCHIZUKI AKIOMI
NAKAZAWA TAKASHI
KOBAYASHI KOJI
FUJINAWA MITSUGI
TATEZAWA TAKASHI
Application Number:
JP2010202160A
Publication Date:
February 17, 2011
Filing Date:
September 09, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J201/00; C09J4/02; C09J5/00; C09J9/02; C09J11/00; H01B1/20; H01R11/01; H05K1/14
Domestic Patent References:
| JP2006318990A | 2006-11-24 |
Foreign References:
| WO2001015505A1 | 2001-03-01 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Yoshinori Shimizu
Hiroyuki Hirano
Tomoya Furoshita
Yoshiki Kuroki
Yoshinori Shimizu
Hiroyuki Hirano
Tomoya Furoshita
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