Title:
CIRCUIT DEVICE AND DIGITAL BROADCAST RECEIVING DEVICE
Document Type and Number:
Japanese Patent JP2008164385
Kind Code:
A
Abstract:
To enable an operation test of a semiconductor device sealed in a package and to downsize the package.
A circuit device includes: a wiring board having a plurality of wiring layers including at least a first wiring layer disposed on one face and a second wiring layer on the other face; an integrated circuit having a plurality of terminals connected to the first wiring layer, that is sealed with a sealing resin on the one face; a connection electrode connected to part of the plurality of terminals of the integrated circuit, that is exposed without being sealed with a sealing resin; and a test terminal connected to others of the plurality of terminals of the integrated circuit, that is disposed in the second wiring layer.
Inventors:
NAGASAWA TAKAFUMI
TANAHASHI NAOKI
TANAKA TOKU
KOBAYASHI KENICHI
NAKANO ATSUSHI
TANAHASHI NAOKI
TANAKA TOKU
KOBAYASHI KENICHI
NAKANO ATSUSHI
Application Number:
JP2006353100A
Publication Date:
July 17, 2008
Filing Date:
December 27, 2006
Export Citation:
Assignee:
SANYO ELECTRIC CO
SANYO SEMICONDUCTOR CO LTD
SANYO SEMICONDUCTOR CO LTD
International Classes:
G01R31/28; H04B1/08; H05K1/11
Domestic Patent References:
| JP2006158152A | 2006-06-15 | |||
| JP2003066113A | 2003-03-05 | |||
| JP2001008184A | 2001-01-12 | |||
| JP2006071292A | 2006-03-16 | |||
| JP2002232104A | 2002-08-16 |
Foreign References:
| WO2005010812A1 | 2005-02-03 |
Attorney, Agent or Firm:
Isshiki International Patent Service Corporation
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