Title:
CLEANING AGENT FOR COPPER WIRING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP2012021151
Kind Code:
A
Abstract:
To provide a cleaning agent for a copper wiring semiconductor, excellent in the removing performance of an abrasive grain derived from an abrasive, excellent in the removing performance of a metal residue and an organic residue on an insulating film, and also excellent in the corrosion resistance of copper wiring.
The cleaning agent is used in a process succeeding to chemical mechanical polishing in a semiconductor manufacturing process for forming copper wiring or copper-alloy wiring. The cleaning agent for the copper wiring semiconductor is also characterized in that, amine (A), a guanidine salt or a guanidine derivative salt (B) and water are used as essential components, and pH at use is 8.0 to 13.0.
Inventors:
SAITO HIDEAKI
YOSHIDA YUTAKA
YOSHIMOCHI HIROSHI
KOMICHI YUKICHI
YOSHIDA YUTAKA
YOSHIMOCHI HIROSHI
KOMICHI YUKICHI
Application Number:
JP2011133560A
Publication Date:
February 02, 2012
Filing Date:
June 15, 2011
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C11D7/32; C11D3/26; C11D3/30; H01L21/304; H01L21/3205
Domestic Patent References:
| JP2005507166A | 2005-03-10 | |||
| JP2005502734A | 2005-01-27 | |||
| JP2004031890A | 2004-01-29 | |||
| JP2004527105A | 2004-09-02 | |||
| JP2008219009A | 2008-09-18 | |||
| JP2007016232A | 2007-01-25 | |||
| JPH06250403A | 1994-09-09 | |||
| JP2003292993A | 2003-10-15 |
Other References:
一般社団法人日本銅センターウェブサイト, JPN6016005122, 2005, pages Ｑ＆Ａ，カテゴリ「その他」, ISSN: 0003253990
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