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Patent Searching and Data


Title:
CLEANING AGENT FOR MOLD FOR POLYESTER RESIN AND CLEANING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2000008087
Kind Code:
A
Abstract:

To obtain the subject cleaning agent by using a hydrogenated biphenyl or hydrogenated terphenyl compound so as to be capable of efficiently, nearly entirely cleaning molds used for molding polyester resins of deposits adhered onto the molds.

This cleaning agent for molds used for molding polyester resins (e.g. predominant in polyester resins with ethylene terephthalate unit as the major repeating unit) is such one as to use (A) a hydrogenated biphenyl compound such as cyclohexylbenzene or bicyclohexy or (B) a hydrogenated terphenyl compound such as a mixture of terphenyl isomer's partially hydrogenated compounds. The cleaning agent exhibits the high ability to dissolve polyester oligomers such as ethylene terephthalate cyclic trimer as mold deposits, can efficiently remove mold deposits, and furthermore, because of having a high boiling point, can clean high-temperature molds without cooling.


Inventors:
MATSUI YOSHINAO
SONODA HIROTOSHI
KIMURA OSATAKE
ETO YOSHITAKA
Application Number:
JP17728598A
Publication Date:
January 11, 2000
Filing Date:
June 24, 1998
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
B29C33/72; C11D7/24; (IPC1-7): C11D7/24; B29C33/72