Title:
半導体デバイス用基板の洗浄液、半導体デバイス用基板の洗浄方法、半導体デバイス用基板の製造方法及び半導体デバイス用基板
Document Type and Number:
Japanese Patent JP7400898
Kind Code:
B2
Abstract:
The present invention relates to a washing solution for substrates for semiconductor devices, which has a pH value of 8 to 11.5 inclusive and contains a component (A) which is a compound comprising at least one compound selected from the group consisting of compounds respectively represented by general formulae (1) to (3), a component (B) which is ascorbic acid, a component (C) which is a polycarboxylic acid or a hydroxycarboxylic acid, a component (D) which is a pH modifier, and a component (E) which is water. (In the formulae, R1 to R6, R11 to R17 and R21 to R28 are as defined in the description.)
Inventors:
Toshiaki Shibata
Ken Harada
Tomohiro Kusano
Yutaro Takeshita
Yasuhiro Kawase
Ken Harada
Tomohiro Kusano
Yutaro Takeshita
Yasuhiro Kawase
Application Number:
JP2022128053A
Publication Date:
December 19, 2023
Filing Date:
August 10, 2022
Export Citation:
Assignee:
Mitsubishi Chemical Corporation
International Classes:
H01L21/304; C11D7/22; C11D7/26; C11D7/32
Domestic Patent References:
| JP2014170927A | ||||
| JP2014212262A | ||||
| JP2014049521A | ||||
| JP2015165562A | ||||
| JP2010287751A |
Foreign References:
| WO2001071789A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Eiko Office