Title:
CLOSE CONTACT IMAGE SENSOR
Document Type and Number:
Japanese Patent JP3142483
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a close contact image sensor without dispersion of resolu tion by covering bear chip sensor IC with transparent resin with low viscosity from above in a film form.
SOLUTION: A conductive pattern 10 is provided on a sensor substrate 4. One or plural bear chip sensors IC 5 which are arranged in a straight line are electrically connected with the conductive pattern 10 by plural wires 11. The bear chip sensors IC 5 can be arranged on the sensor substrate 4 or can be arranged on the other member adjacent to the sensor substrate 4. Bear chip sensor IC 5 is covered by colorless and transparent silicone resin 12 with low viscosity in the thin film form. Since the dispersion in thickness of the resin layer 12 becomes not more than several tens of μm, the dispersion of an optical distance between a rod lens array and bear chip sensor IC is reduced. Thus, the dispersion of the resolution of the contact image sensor is reduced.
Inventors:
Toshiro Matsumoto
Application Number:
JP16446896A
Publication Date:
March 07, 2001
Filing Date:
June 25, 1996
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L27/14; H01L31/02; H04N1/028; (IPC1-7): H04N1/028; H01L27/14; H01L31/02
Domestic Patent References:
| JP7240816A |
Attorney, Agent or Firm:
Kenji Yoshida (2 outside)