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Title:
COATING SYSTEM FOR PACKAGING SUBSTRATE
Document Type and Number:
Japanese Patent JPH07275781
Kind Code:
A
Abstract:

PURPOSE: To provide a coating system for packaging substrates capable of assuring a uniform film thickness even in the case two surfaces, front and rear, of these packaging substrates are subjected to coating and to provide a system with which the entire part is packaged compact even in the case a drying stage is included between coating of the two surfaces, front and rear.

CONSTITUTION: This coating system is successively disposed with a coating robot 3, a drying device 6 and an inverting device 8 in mid-way of a route for transporting the packaging substrates and is disposed with conveyors 2, 4, 5, 7 in such a manner that the packaging substrates circulate through the respective apparatus 3, 6, 8. The coating system described above is so constituted as to execute coating in order of drying of the front side of the packaging substrates, inverting of the substrates after drying, coating of the rear side and drying of the substrates again. The drying device 6 which circulates magazine racks to be inserted with the packaging substrates in many stages within the drying device is adopted in terms of the compact constitution of the system.


Inventors:
KOMORI KATSUHIKO
Application Number:
JP9369094A
Publication Date:
October 24, 1995
Filing Date:
April 06, 1994
Export Citation:
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Assignee:
SHINKO ELECTRIC CO LTD
International Classes:
B05B12/00; B05C5/00; B05C9/14; B05C13/02; H05K13/04; (IPC1-7): B05C13/02; B05B12/00; B05C5/00; B05C9/14; H05K13/04
Attorney, Agent or Firm:
Kaji Yoshiyuki



 
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