Title:
COIL WITH PAD AND ITS PROCESS FOR FABRICATION
Document Type and Number:
Japanese Patent JP2007243151
Kind Code:
A
Abstract:
To provide a coil with a pad, along with its process for fabrication, which is applied for mass production, with good jointing strength and reliability at the connection part between a coil body and a pad.
The process for fabrication of a coil with a pad includes following steps. At least one conductive bump S is formed on a substrate 1 comprising at least one pad 11. At least one end of at least one coil body C is placed on the pad 11, and the end of the coil body C is made to contact the corresponding conductive bump S. Then, the shape of the conductive bump S is changed so that the conductive bump S connects the coil body C to the pad 11.
COPYRIGHT: (C)2007,JPO&INPIT
Inventors:
HUANG RU-KUEN
CHEN CHIEH-CHENG
CHEN CHIEH-CHENG
Application Number:
JP2006342080A
Publication Date:
September 20, 2007
Filing Date:
December 20, 2006
Export Citation:
Assignee:
TAIDA ELECTRONIC IND CO LTD
International Classes:
H01F41/10; H01F5/04; H01F27/28
Attorney, Agent or Firm:
Mamoru Ushiki
Masayoshi Yoshida
Koji Matsuura
Shimizu Sakaematsu
Masayoshi Yoshida
Koji Matsuura
Shimizu Sakaematsu