Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP2009260081
Kind Code:
A
Abstract:
To provide a component mounting device that can detect a position where a backup pin is erected without moving a component mounting head at low cost.
The component mounting device has a backup table 14 disposed below a position of a substrate when a component is mounted and a backup pin 18 erected on the backup table 14, wherein a touch panel 16 is disposed on the backup table 14, and a pushing force from the backup pin 18 erected on the touch panel 16 is detected by the touch panel 16, thereby detecting the position where the backup pin 18 is erected.
Inventors:
NAKAYAMA HIDEO
Application Number:
JP2008108113A
Publication Date:
November 05, 2009
Filing Date:
April 17, 2008
Export Citation:
Assignee:
JUKI KK
International Classes:
H05K13/04
Attorney, Agent or Firm:
Satoshi Takaya
Keisuke Matsuyama
Tsuyoshi Makino
Keisuke Matsuyama
Tsuyoshi Makino
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