Title:
COMPOSITE ELECTRONIC PARTS AND THEIR MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3221253
Kind Code:
B2
Abstract:
PURPOSE: To reduce a working cost and material cost of a reed terminal by connecting and fixing a preliminarily fixed resonator element and a capacitor element in a state that the elements are held between three terminals.
CONSTITUTION: In a state that a resonator element 1 and a capacitor element 10 are adhered and fixed with each other and three reed terminals 20, 30 40 are connected, a sealing is integrally performed by the exterior resin 60 around these elements. Namely, on the surface of the element 10, the one main surface of the element 1 is adhered and fixed with adhesive 15, and vibration space VS is formed between the element 10 and the element 1 by the thickness of the adhesive 15. When conductive adhesive is used, electrodes 3 and 12 and electrodes 4 and 13 are made conductive one another at the stage in which the element 1 and the element 10 are adhered. After the terminals 20, 30 and 40 are connected, the surroundings of a composite electronic parts are sealed with exterior resin 60. Before the sealing, the surroundings of the element 1 and the element 10 are covered with elastic body such as silicone rubber, etc., and the surroundings are sealed by the exterior resin.
Inventors:
Daisaku Kugo
Sanae Sanada
Nobuaki Sumino
Kunikazu Nakahara
Sanae Sanada
Nobuaki Sumino
Kunikazu Nakahara
Application Number:
JP24713894A
Publication Date:
October 22, 2001
Filing Date:
September 13, 1994
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/40; H03H3/02; H03H9/02; H03H9/05; H03H9/17; H03B5/32; (IPC1-7): H03H3/02
Domestic Patent References:
| JP62292011A | ||||
| JP60123120A | ||||
| JP3128326U | ||||
| JP334321U |
Attorney, Agent or Firm:
Hidetaka Tsutsui