Title:
複合磁性封止材料及びこれをモールド材として用いた電子回路パッケージ
Document Type and Number:
Japanese Patent JP6380615
Kind Code:
B2
Abstract:
Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blend ratio of 50 vol. % or more and 85 vol. % or less. The filler includes a first magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, the first magnetic filler having a first grain size distribution, and a second magnetic filler having a second grain size distribution different from the first grain size distribution.
Inventors:
Kenichi Kawabata
Application Number:
JP2017109242A
Publication Date:
August 29, 2018
Filing Date:
June 01, 2017
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01L23/00; C08K3/00; C08L101/00; C22C38/00; H01F1/147; H01F1/26; H01F1/33; H01L23/29; H01L23/31; H05K9/00
Domestic Patent References:
| JP2005347449A | ||||
| JP5005162A | ||||
| JP2010087058A | ||||
| JP2001284498A | ||||
| JP5988003B2 | ||||
| JP2008081818A | ||||
| JP2015061000A | ||||
| JP2010103709A1 | ||||
| JP2004200567A | ||||
| JP1064714A |
Foreign References:
| US20050045358 |
Attorney, Agent or Firm:
Mitsuhiro Washito
Ogata Japanese
Yasuyuki Kurose
Ogata Japanese
Yasuyuki Kurose