Title:
COMPOSITE SHEET FOR FORMING RESIN FILM
Document Type and Number:
Japanese Patent JP2015123715
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a composite sheet for forming a resin film capable of preventing transfer of a component constituting a film for forming the resin film to an adhesive layer, which is an adhesive sheet for dicing/die bonding for simplifying a pick-up step or a bonding step after being stuck on a wafer for producing a semiconductor chip.SOLUTION: A composite sheet 10 for forming a resin film has an adhesive sheet having an adhesive layer 2 on a substrate 1, and a film 4 for forming the resin film provided on the adhesive layer. The adhesive layer contains a polyisobutylene rubber-based resin.
Inventors:
KARASAWA YASUNORI
Application Number:
JP2013271149A
Publication Date:
July 06, 2015
Filing Date:
December 27, 2013
Export Citation:
Assignee:
LINTEC CORP
International Classes:
B32B25/08; C09J7/02; C09J123/22
Domestic Patent References:
| JP2012033637A | 2012-02-16 | |||
| JP2011174042A | 2011-09-08 | |||
| JP2011231313A | 2011-11-17 | |||
| JPH06170997A | 1994-06-21 |
Foreign References:
| WO2013002288A1 | 2013-01-03 | |||
| WO2013137397A1 | 2013-09-19 | |||
| US20120028418A1 | 2012-02-02 | |||
| WO2012132520A1 | 2012-10-04 |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation