Title:
複合基板及びその製造方法
Document Type and Number:
Japanese Patent JP7331420
Kind Code:
B2
Abstract:
To provide a composite substrate and a manufacturing method thereof capable of ensuring good elasticity between adjacent wiring boards having been subjected to tiling.SOLUTION: A composite substrate 1 includes a plurality of wiring boards 10 arranged in a sheet shape, and a plurality of connection portions 20 provided so as to straddle between the wiring boards 10 in order to electrically connect the adjacent wiring boards 10 from among the plurality of wiring boards 10. The wiring board 10 includes a plurality of connection electrodes 130 arranged on the surface along at least a part of the outer edge. A connection electrode 130 of one wiring board 10 of the adjacent wiring boards 10 is close to a corresponding connection electrode 130 of the other wiring board 10 in a direction in which the adjacent wiring boards 10 are lined up. Each of the connection portions 20 has elasticity, and connects the connection electrode 130 of one wiring board 10 and the corresponding connection electrode 130 of the other wiring board 10 which are close to each other in the direction in which the adjacent wiring boards 10 are arranged in a series.SELECTED DRAWING: Figure 1
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Inventors:
Toru Miyoshi
Application Number:
JP2019070148A
Publication Date:
August 23, 2023
Filing Date:
April 01, 2019
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K1/11; H01L21/336; H01L29/786; H05K1/14; H05K3/28; H05K3/36; H05K3/40
Domestic Patent References:
| JP2018532250A | ||||
| JP2016017753A | ||||
| JP2014107484A | ||||
| JP6325840A |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Satoru Asakura
Yukihiro Hotta
Yoshiki Kanagawa
Yukitaka Nakamura
Satoru Asakura
Yukihiro Hotta
Yoshiki Kanagawa
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