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Patent Searching and Data


Title:
COMPOSITE WOODY PANEL AND WOODY BUILDING MATERIAL
Document Type and Number:
Japanese Patent JP2008173820
Kind Code:
A
Abstract:

To provide a composite woody panel which is simply and inexpensively prevented from the occurrence of warpage accompanied by a moisture absorbing and discharging dimensional change, while effectively utilizing the surface smoothness being inherent in an engineering board such as MDF or PB and has rigidity.

Woody veneer 3, of which the moisture absorbing and discharging characteristics are equal to those of a woody base material 2 is laminated on the back of the woody base material. The composite woody panel is upwardly warped so that the surface side of the woody base material having the woody veneer laminated on its back is raised. The woody veneer is laminated to the surface of the woody base material of the composite woody panel having a first or second feature.


Inventors:
SUZUKI SHINICHI
MAEDA NAOHIKO
Application Number:
JP2007008100A
Publication Date:
July 31, 2008
Filing Date:
January 17, 2007
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B27N3/00; B32B21/13; E04F15/04
Attorney, Agent or Firm:
Toshio Nishizawa