Title:
COMPOSITION, CURED PRODUCT AND OPTICAL SEMICONDUCTOR SEALING MATERIAL
Document Type and Number:
Japanese Patent JP2010248385
Kind Code:
A
Abstract:
To provide a composition capable of yielding a cured product that does not cause separation etc. from a substrate or an electrode part of an LED package, even under high-temperature conditions such as those adopted in a solder reflow step etc., and a composition capable of yielding a cured product showing sufficient curability and crack resistance, even when the formed cured product has a film thickness on the order of millimeters.
The composition comprises (A) a polyorganosiloxane containing at least one epoxy group and (B) a compound having a carbon-carbon triple bond and a hydroxyl group.
Inventors:
MOTONARI MASAYUKI
KASHISHITA KOSHI
YAMADA KINJI
KASHISHITA KOSHI
YAMADA KINJI
Application Number:
JP2009099954A
Publication Date:
November 04, 2010
Filing Date:
April 16, 2009
Export Citation:
Assignee:
JSR CORP
International Classes:
C08L83/06; C08K5/05; C08K5/092; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2006265274A | 2006-10-05 | |||
| JP2008120850A | 2008-05-29 | |||
| JP2008304820A | 2008-12-18 | |||
| JP2008019424A | 2008-01-31 | |||
| JP2008202036A | 2008-09-04 | |||
| JP2007197618A | 2007-08-09 |
Attorney, Agent or Firm:
Koji Makimura
Chihata Takahata
Chihata Takahata
Previous Patent: SILICONE COMPOSITION
Next Patent: METHOD FOR PRODUCING ANISOTROPIC CONDUCTIVE ADHESIVE FILM
Next Patent: METHOD FOR PRODUCING ANISOTROPIC CONDUCTIVE ADHESIVE FILM