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Title:
COMPOSITION FOR MOLDING SLIDING MATERIAL
Document Type and Number:
Japanese Patent JPS5943058
Kind Code:
A
Abstract:

PURPOSE: To provide the titled compsn. having excellent lubricity and wear resistance at elevated temp. and excellent heat resistance, consisting of a specified thermosetting resin, a fluororesin and MoS2.

CONSTITUTION: 100pts.wt. dimaleimide compd. of formula I (wherein R1 is H, alkyl; R2 is a bivalent org. group selected from -O-, -CH2-, -SO2- and -S-S-; R3 is H, halogen), 10W30pts.wt. aminophenol of formula II (wherein R4 is H, halogen, alkyl; a is 1, 2), 20W100pts.wt. epoxy compd. such as bisphenol A type epoxy resin and 0.1W2pts.wt. compd. of formula III (wherein R5WR8 are each H, alkyl) are reacted together to obtain a thermosetting resin (A). 20W80wt% component A, 2W60wt% fluororesin such as polytetrafluoroethylene and 2W 40wt% MoS2 are blended together.


Inventors:
OOKAWA TSUTOMU
MATSUDA ITSUO
Application Number:
JP15338982A
Publication Date:
March 09, 1984
Filing Date:
September 04, 1982
Export Citation:
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Assignee:
TOSHIBA CHEM PROD
International Classes:
C08L79/08; C08G59/00; C08G59/40; C08G73/10; C08L1/00; C08L27/00; (IPC1-7): C08G59/40; C08G73/10; C08L79/08
Domestic Patent References:
JPS573822A1982-01-09
JPS4888148A1973-11-19
Attorney, Agent or Firm:
Eiji Morota