Title:
COMPOSITION FOR SOLDERING PHOTORESIST INK
Document Type and Number:
Japanese Patent JPH08272095
Kind Code:
A
Abstract:
PURPOSE: To provide compsn. having satisfactory dil. alkali developability, contg. a UV-curing resin having a long shelf life and giving a cured coating film excellent in adhesion, heat and moisture resistances and electric insulating property.
CONSTITUTION: In this compsn. contg. a UV-curing resin, a photopolymn. initiator, a diluent and a thermosetting resin, the UV-curing resin is obtd. by allowing a dibasic acid anhydride having a mol. wt. of ≤120 and a dibasic acid anhydride having a mol. wt. of ≥140 in a molar ratio of 1:9 to 9:1 to react simultaneously with a reactional product of a novolak type epoxy compd. with unsatd. mono- carboxylic acid.
Inventors:
SAITO MASAHARU
TSUKATANI TOSHIHIDE
MAKINO KIMIHIRO
TSUKATANI TOSHIHIDE
MAKINO KIMIHIRO
Application Number:
JP9600195A
Publication Date:
October 18, 1996
Filing Date:
March 29, 1995
Export Citation:
Assignee:
NIKKA CHEMICAL IND CO LTD
International Classes:
G03F7/027; C08F2/48; C09D11/00; C09D11/033; C09D11/10; C09D11/102; C09D11/106; G03F7/028; G03F7/032; G03F7/035; H05K3/28; (IPC1-7): G03F7/027; C08F2/48; C09D11/00; C09D11/10; G03F7/028; G03F7/032; G03F7/035; H05K3/28
Attorney, Agent or Firm:
内山 充