Title:
Compound board
Document Type and Number:
Japanese Patent JP6107941
Kind Code:
B2
Abstract:
The objective of the present invention is, in a composite substrate comprising a plurality of substrates that are stacked, to achieve a low profile by making the substrates thinner and to prevent cracking of the substrates and interconnect failure between pillar-shaped conductors and the substrates, which would result therefrom. A composite substrate (1) is provided with: a rigid substrate (2); a first sealing resin layer (4) stacked onto the rigid substrate (2); a flexible substrate (3) stacked onto the first sealing resin layer (4); a second sealing resin layer (5) stacked onto the flexible substrate (3); and pillar-shaped substrates (6) provided within the first sealing resin layer (4) and connecting the rigid substrate (2) and the flexible substrate (3). As a result, even in a case in which the flexible substrate (3) is made thin in order to achieve a low profile for the composite substrate (1), the flexible substrate (3) will not crack from heat shrinkage when the first and second sealing resin layers (4 and 5) are cured. In addition, as a result of flexibility of the flexible substrate (3), stress acting on the connecting portions between the pillar-shaped substrates (6) and the flexible substrate (3) is alleviated, and therefore, it is possible to prevent interconnect failure therebetween.
Inventors:
Yoshito Otsubo
Application Number:
JP2015514741A
Publication Date:
April 05, 2017
Filing Date:
December 05, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01L25/04; H01L23/12; H01L25/065; H01L25/07; H01L25/18; H05K1/02; H05K1/14; H05K3/28; H05K3/46
Domestic Patent References:
| JP2004146495A | ||||
| JP1230289A | ||||
| JP2004134669A | ||||
| JP2008135781A |
Attorney, Agent or Firm:
Ryose Uji
Kakusho Shoichi
Maruyama Yosuke
Kakusho Shoichi
Maruyama Yosuke