To perform polishing in a low polishing pressure region at faster speed without a plurality of power supplies while uniformity of polishing speed in a face of a polished object such as a wafer is inexpensively and easily secured.
A compound electrolytic polishing apparatus is provided with a polishing table 100 having a first electrode 256 consisting of a plurality of divided electrodes 256a to 256c connected to one pole of a power supply 254 and holding a polishing pad 101, a top ring 1 holding a polishing object and depressing it to a polishing face of the polishing pad, a second electrode 286 which is connected to the other pole of the power supply 254 and supplies power to a conductive film being the polishing object, a detecting part 274 detecting a signal corresponding to remaining film thickness of the conductive film, a variable resistance unit 270 which individually connects one pole of the power supply 254 and respective divided electrodes 256a to 256c through variable resistors 268a to 268c and a control part 280 controlling the variable resistors 268a to 268c of the variable resistance unit 270 based on the signal from the detecting part 274.
TAIMA YASUSHI
KODERA AKIRA
SUZUKI TSUKURU
MAKITA YUJI
Shintaro Hotta
Ryoji Kosugi
Tetsuya Hirosawa
Next Patent: LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD