Title:
COMPOUND, RESIN USING THE SAME, RESIN COMPOSITION, CURED FILM, ORGANIC EL DISPLAY DEVICE, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2020033277
Kind Code:
A
Abstract:
To provide a compound for obtaining a cured film which has low thermal expansion, is excellent in chemical resistance and enables uniform wiring pattern formation after heat treatment while having good pattern workability; a resin using the compound; and a resin composition using the resin.SOLUTION: There are provided a compound represented by A-1, and tetracarboxylic acid dianhydride forming polyimide or polyamide in combination with the compound.SELECTED DRAWING: None
Inventors:
MASUDA YUKI
Application Number:
JP2018158943A
Publication Date:
March 05, 2020
Filing Date:
August 28, 2018
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C07C237/40; C07D307/89; C08G73/10; G03F7/023; G09F9/30; H01L27/32; H01L51/50; H05B33/12; H05B33/22