Title:
化合物半導体基板
Document Type and Number:
Japanese Patent JP3592922
Kind Code:
B2
Inventors:
Ei Higuchi
Application Number:
JP4702398A
Publication Date:
November 24, 2004
Filing Date:
February 27, 1998
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L21/20; H01L21/205; H01L21/22; H01L33/30; H01L33/34; (IPC1-7): H01L21/205; H01L21/20; H01L21/22; H01L33/00
Domestic Patent References:
| JP8236453A | ||||
| JP7273024A | ||||
| JP8288215A |