Title:
圧縮成型用液状樹脂組成物及び電子部品装置
Document Type and Number:
Japanese Patent JP7148508
Kind Code:
B2
Abstract:
A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).
Inventors:
Inoue Hidetoshi
Takayuki Matsuzaki
Judo Takahashi
Go Uemura
Toshi Yoshii
Takayuki Matsuzaki
Judo Takahashi
Go Uemura
Toshi Yoshii
Application Number:
JP2019521314A
Publication Date:
October 05, 2022
Filing Date:
May 31, 2018
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
Namics Co., Ltd.
Namics Co., Ltd.
International Classes:
C08G59/20; B29C43/18; B29C43/34; C08K3/013; C08K5/54; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2015013950A | ||||
| JP2006176678A | ||||
| JP2012060021A | ||||
| JP2008045123A | ||||
| JP2012077129A | ||||
| JP2017039802A | ||||
| JP2015174906A | ||||
| JP2003335923A |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office
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