Title:
CONDUCTIVE ADHESIVE, CONDUCTIVE SHEET, AND DICING DIE BOND FILM
Document Type and Number:
Japanese Patent JP2023068799
Kind Code:
A
Abstract:
To provide a conductive adhesive or the like that can prevent the viscosity of a conductive adhesive composition from increasing with time.SOLUTION: A conductive adhesive according to the present invention comprises an elastomer and metal particles, the metal particles comprising copper particles, and the molar concentration of carboxy groups in the conductive adhesive being 2.0 μmol/g or less.SELECTED DRAWING: None
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Inventors:
TANIGUCHI SHUTO
ICHIKAWA TOMOAKI
ICHIKAWA TOMOAKI
Application Number:
JP2021180131A
Publication Date:
May 18, 2023
Filing Date:
November 04, 2021
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J121/00; C09J7/38; C09J9/02; C09J11/04; C09J201/00; H01B1/00; H01B1/22; H01B5/14; H01L21/52
Attorney, Agent or Firm:
Patent Attorney Corporation Fujimoto Partners
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