Title:
導電性組成物
Document Type and Number:
Japanese Patent JP6655605
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide a means that exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. Namely, it is an electrically conductive composition, which contains at least a sulfide compound represented by R-S-R' (wherein R is an organic group containing at least carbon; R' is an organic group that is the same as or different from R; and R and R' may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film, each of which are produced using the electrically conductive composition, as well as a dicing die bonding film, which is obtained by bonding the conductive bonding film with an adhesive tape, are provided.
Inventors:
Naoaki Mihara
Switching Tokuyuki
Jiro Sugiyama
Switching Tokuyuki
Jiro Sugiyama
Application Number:
JP2017510424A
Publication Date:
February 26, 2020
Filing Date:
July 22, 2016
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01B1/22; C09J7/10; C09J7/20; C09J7/35; C09J9/02; C09J11/04; C09J11/06; C09J163/00; C09J179/04; C09J201/00; H01B1/00; H01L21/301; H01L21/52
Domestic Patent References:
| JP10261319A | ||||
| JP2004355933A | ||||
| JP2004189954A | ||||
| JP2014049621A | ||||
| JP2010221260A |
Foreign References:
| WO2009057530A1 |
Attorney, Agent or Firm:
Seiichi Inoue